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Samsung on Tuesday revealed when it will launch its 2-nanometer (nm) process for which applications in the coming years.
The South Korean tech giant said it will begin mass production of 2nm chips for use in mobile applications in 2025, during the Samsung Foundry Forum held in San Jose, California.
This means it will offer to make the application processors used in smartphones and tablets in the 2nm process for customers aiming to launch processors at that size.
The nm measurement refers to the channel length of the transistors that comprise a chip. Advanced processors contain billions of transistors and their shorter channel lengths mean that more transistors can be packed into a single chip, allowing them to perform better.
Samsung Foundry, the contract chip-producing business unit of the tech giant, provides its manufacturing services to customers such as Qualcomm and Samsung’s smartphone business unit.
After 2025, Samsung said it will offer 2nm chip production for high-performance computing in 2026 and process for automotive chips in 2027.
The company said its 2nm process has seen a 12% increase and a 25% increase in performance and power efficiency, respectively, compared to its 3nm process, which it launched last year, a first among chip makers. Samsung said its 2nm process also offers 5% smaller chips than its 3nm process.
Meanwhile, the company reiterated that it will begin mass production of chips in 2027 using its 1.4nm process.
In 2025, it will also begin offering contract production for 8-inch gallium nitride (GaN) power management chips as well as 5nm RF chips. It will also begin offering 8nm and 14nm RF chips for automotive applications.
Additionally, Samsung aims to increase its clean room capacity by 7.3 times by 2027 compared to 2021. This will be achieved through the expansion of its fab in Pyeongtaek__ its most advanced facility ever__ and its new fab being built in Taylor, Texas. , the company said. More clean rooms means it will have more space to execute more orders from customers.
At the forum, Samsung also announced the formation of its Multi-Die Integration Alliance, an alliance with its partners to implement new chip packaging technologies.
Samsung is the world’s second-largest contract chip maker after TSMC, which produces Apple’s A-series chips used in the iPhone.
